AJA
BSG-200
The AJA BSG-200 Series Substrate Holder is designed to handle wafers or similar planar substrates up to 200 mm in diameter. The AJA BSG-200 Series Substrate Holder features direct backside He, Ar or N2 gas cooling while rotating. The AJA BSG-200 Series Substrate Holder is load-lock compatible.[1][2][3]
What it is
The AJA BSG-200 Series Substrate Holder handles wafers or similar planar substrates up to 200 mm in diameter. The holder features direct backside He, Ar or N2 gas cooling while rotating. The BSG-200 is load-lock compatible.[3]
How it works
A peripheral weight ring around the outer edge of the substrates helps maintain a two orders of magnitude higher backside gas pressure for optimal heat transfer to the water cooled platen. Shielding of surrounding materials and weight rings can be provided with compatible metal, ceramic or TiNx coatings to prevent substrate contamination from the substrate holder. The BSG-200 features serpentine gas channels for backside gas cooling.[3]
Applications
General reference — not yet source-verifiedIon milling substrate holders such as the BSG-200 are used in applications that include nano pattern delineation, bulk wafer planarization, and reactive ion beam etching. The backside gas cooling capability enables stable temperature control during ion milling processes, which is important for sensitive substrates and reactive gas chemistries.
- Used as a rotating wafer table with backside gas cooling in an ion milling process
- Handling wafers or similar planar substrates
What do the numbers mean?
Vacuum & pumping3
- Pressure-enhancement feature
- Peripheral weight ring around the outer edge of the substrates to maintain a 2 orders of magnitude higher backside gas pressure[1]
- Peripheral weight ring function
- Maintains 2 orders of magnitude higher backside gas pressure for optimal heat transfer to the water cooled platen[1]
Wafer handling6
- Associated system usage
- used with a BSG200 rotating wafer table equipped with helium gas backside cooling and programmable working distance adjustment[1]
Gas & chemistry4
Configuration & options5
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- CoolingDirect backside He, Ar or N2 gas cooling while rotating[1]
- Pressure-enhancement featurePeripheral weight ring around the outer edge of the substrates to maintain a 2 orders of magnitude higher backside gas pressure[1]
- Backside cooling gasesHe, Ar or N2[1]
- Cooling methodDirect backside gas cooling while rotating[1]
- Peripheral weight ring functionMaintains 2 orders of magnitude higher backside gas pressure for optimal heat transfer to the water cooled platen[1]
- Backside gas pressure increase2 orders of magnitude higher[3]
- Coolingdirect backside He, Ar or N2 gas cooling[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What kinds of workpieces use this class of holder?General reference — not yet source-verified
Such holders are used for flat substrates such as wafers, glass pieces, and other planar materials that need controlled positioning.
Why is positioning important for this class of equipment?General reference — not yet source-verified
Correct positioning helps ensure that the process is applied to the intended area and that the workpiece remains stable during treatment.
Not publicly documented
The following facts about the BSG-200 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the BSG-200 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the BSG-200 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the BSG-200 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the BSG-200 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the BSG-200 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]web.archive.org — web.archive.orgweb.archive.org
- [2]web.archive.org — web.archive.orgweb.archive.org
- [3]web.archive.org — web.archive.orgweb.archive.org
Last updated Oct 4, 2026.
