Comparison ledger
West Bond 10100, West Bond 7416A, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 10100West Bond | 7416AWest Bond |
|---|---|---|
| OEM | West Bond | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | West Bond 10100 | West Bond 7416A |
| Specifications | ||
| Equipment type | — | Wire bonder[1] |
| Bonding method | — | Thermocompression wedge[1] |
| Model | — | 7416A[2] |
| Wire bond style | — | Wedge[3] |
| Operation | — | Manual[3] |
| Channels | — | 2 (CHAN 1 and CHAN 2)[3] |
| Input voltage | — | 115V AC, 50/60 Hz[3] |
| Wire range | — | 0.5 mil (12 microns) to 2 mil (50 microns)[2] |
| Form factor | — | Benchtop[3] |
Plan your fab
Building a Packaging & Bonding process? Get a complete equipment list.
Open the fab equipment planner →