Waferpedia

Comparison ledger

10100versus353637 E 90

West Bond 10100, West Bond 353637 E 90, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
10100West Bond
353637 E 90West Bond
OEMWest BondWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyWest Bond 10100West Bond 353637 E 90
Specifications
Bonding Area—5.375" × 9.5" (5 3/8" × 9 1/2")[1]
Configuration—2400B Series software[1]

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Sources (1)Every fact above is drawn from these public sources
  1. [1]inventory listing