Comparison ledger
Veeco Dektak, Zygo Z3D-7000, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | DektakVeeco | Z3D-7000Zygo |
|---|---|---|
| OEM | Veeco | Zygo |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | 200mm | 200mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | 5th generation |
| Family | Veeco Dektak | Zygo Z3D-7000 |
| Specifications | ||
| Manufacturer | Veeco[1] | — |
| Model | DEKTAK 150[1] | — |
| Purpose | Stylus-based scanning system for measuring surface topography and thin film step heights[2] | — |
| Tip Size | 12 µm[1] | — |
| Standard Stylus Tip | 2.5 μm[2] | — |
| Scan Length | 55 - 200 mm[1] | — |
| Maximum Data Points per Scan | 120,000[1] | — |
| Maximum Sample Size | 200 mm[1] | — |
| Sample Diameter | up to 200 mm in diameter[2] | — |
| Sample Thickness | up to 90 mm thick[2] | — |
| Stylus Force | 1 - 15 mg[1] | — |
| X-Y Translation | 101.6 x 101.6 mm[2] | — |
| Stage Type | Two-axis, manual sample-positioning stage[2] | — |
| Stage Leveling and Rotation | Manual stage leveling and rotation[2] | — |
| Leveling | Two-point programmable or cursor software leveling[2] | — |
| Environmental Enclosure | Acrylic environmental enclosure[2] | — |
| Maximum sample thickness | 90 mm[2] | — |
| X-Y translation range | 101.6 x 101.6 mm[2] | — |
| Long scan length | 55 mm[2] | — |
| Measurement type | — | Non-contacting, non-destructive optical metrology[3] |
| Wafer sizes | — | 200 mm and 300 mm wafers[3] |
| Bridge-tool configuration | — | Can be configured to simultaneously handle both wafer sizes[3] |
| Key features | — | High speed non-contacting metrology; simultaneously measures multiple parameters; ISO Class 2, S2/S8, and CE certified; SEMI E95 compliant software; modular IntelliSensors reduce MTBR[3] |
| Technology | — | ZYGO's fifth generation interferometric technology[3] |
| Software | — | MetroPro software[3] |
| Loaded wafers | — | FOUPS and/or open cassettes[3] |
| Throughput | — | Exceeds throughput of contact technologies (profilers, atomic force microscopes) by a factor of 10[3] |
| Simultaneous measurements | — | Film thickness, critical dimensions, overlay, trench depth, and general surface topography[3] |
| Precision | — | Sub-nanometer precision for critical etch depth processes[3] |
| Wafer loading | — | FOUPS and/or open cassettes, pre-alignment, super flat chuck[3] |
| Certifications | — | ISO Class 2, S2/S8, CE certified[3] |
| Software compliance | — | SEMI E95 compliant[3] |
| Modular sensors | — | IntelliSensors reduce MTBR[3] |
| Algorithms | — | OneShot, TopSlice, FilmSlice[3] |
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