Waferpedia

Comparison ledger

1511eversusNE 5700

Tegal 1511e, Ulvac NE 5700, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
1511eTegal
NE 5700Ulvac
OEMTegalUlvac
CategoryEtchEtch
Wafer sizethree- to six-inch wafersWafer Equipment
Process node——
Introduced1984—
Production run1984–—
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyTegal 1511eUlvac NE-5700
Specifications
tool typetri-electrode dual-frequency plasma etch system[1]—
wafer sizethree- to six-inch wafers[1]—
first sold1984[1]—
system characteristicfirst vacuum-loadlocked dual-frequency tri-electrode etch system[1]—
First vacuum-loadlocked dual-frequency tri-electrode etch systemYes[1]—
Wafer size—Wafer Equipment[2]
Wafer Size—150mm[2]
Category—Etch[2]
Process—Metal Etcher[2]
Equipment—Dry Etcher[2]
Make—Ulvac[3]
Model—NE 5700[3]
Equipment type—Etcher[3]
Application—Dry etching system for production[4]
Cluster Configuration—Up to two process chambers[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]dealer listingwotol.com
  3. [3]Equipment inventory listing
  4. [4]ulvac.euulvac.eu