Comparison ledger
Strasbaugh 100R16, Strasbaugh 6 EC, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 100R16Strasbaugh | 6 ECStrasbaugh |
|---|---|---|
| OEM | Strasbaugh | Strasbaugh |
| Category | CMP | CMP |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Strasbaugh 100R16 | Strasbaugh 6 EC |
| Specifications | ||
| type | 1 spindle grinder/polisher[1] | — |
| drive system | DC drive system with 2 motors[1] | — |
| spindle RPM | 1-180 RPM[1] | — |
| eccentric RPM | 1-90 RPM[1] | — |
| controls | digital timer; air down switch; spindle and eccentric speed dials; air regulators[1] | — |
| capacity | 16 inches[1] | — |
| spindle size | 1-8 TPI[1] | — |
| overall dimensions | 28 inches x 36 inches x 48 inches[1] | — |
| weight | 500 lbs[1] | — |
| origin | made in the USA[1] | — |
| Configuration | — | 50/60 Hz[2] |
| Phase | — | 3 Phase[2] |
| Voltage | — | 208 V[2] |
| Full Load | — | 30 A[2] |
| Wafer size (inch) | — | 3, 4[3] |
| Wafer size (mm) | — | 100[4] |
| Input voltage | — | 208 V[2] |
| Frequency | — | 50/60 Hz[2] |
| Full load current | — | 30 A[2] |
| Motor amps | — | 13.6 A[2] |
| Conditioning arm sweep zones | — | 10[5] |
| Pad conditioning zones | — | 20[6] |
| Control interface | — | Color touch-screen GUI[6] |
| Carrier type | — | ViPRR[6] |
| Load station | — | Hydro-Lift[6] |
| Table and spindle motor control | — | Closed-loop RPM[6] |
| Pad conditioning type | — | In-situ and ex-situ[6] |
| Typical applications | — | Si and SiO2 polishing and planarizing[4] |
| Asset / model | — | Strasbaugh 6 EC[2] |
| Power | — | 50/60 Hz, 3 phase, 208 V[2] |
| Motor current | — | 13.6 motor amps[2] |
| Wafer size | — | 100 mm[4] |
| Substrate chucks | — | 3-inch and 4-inch wafers[3] |
| Functions | — | Si and SiO2 polishing and planarizing[4] |
| Programmable controls | — | fully programmable sweep, downpressure, table speed, time, slurry flow[3] |