Comparison ledger
Oxford Instruments plasmapro-ngp80-rie, Plasma-Therm 720/740, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | plasmapro-ngp80-rieOxford Instruments | 720/740Plasma-Therm |
|---|---|---|
| OEM | Oxford Instruments | Plasma-Therm |
| Category | Etch | Etch |
| Wafer size | 200mm | 200mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Oxford Instruments plasmapro-ngp80-rie | Plasma-Therm 720/740 |
| Cited variants | — | |
| Specifications | ||
| Equipment name | Oxford NGP80 RIE[2] | — |
| Tag/alias | Oxford-PlasmaPro-NGP80-RIE[2] | — |
| Process type | plasma etch[2] | — |
| Etch chemistry | CHF3/Ar plasma[3] | — |
| Process temperature | 20°C[3] | — |
| Typical application | Etching of SiO2 hard mask[3] | — |
| plasma chemistry | CHF3/Ar plasma[3] | — |
| use | Etching SiO2 hard mask[3] | — |
| system type | — | dual chamber RIE loadlocked system[1] |
| chemistry | — | chlorine and fluorine based chemistry[1] |
| left chamber designation | — | 740 (left chamber), designated Au exposure system[1] |
| right chamber designation | — | 720 (right chamber), designated for chlorine and fluorine based etching of 2D materials and perovskites[1] |
| wafer capacity | — | up to 200mm diameter wafers[1] |
| Chemistry | — | chlorine and fluorine based[1] |
| Max wafer diameter | — | 200mm[1] |
Plan your fab
Building a Etch process? Get a complete equipment list.
Open the fab equipment planner →