Comparison ledger
Mattson Aspen, Mattson Aspen II, Mattson Aspen III, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | AspenMattson | Aspen IIMattson | Aspen IIIMattson |
|---|---|---|---|
| OEM | Mattson | Mattson | Mattson |
| Category | Deposition | — | — |
| Wafer size | — | — | — |
| Process node | — | — | — |
| Introduced | — | — | — |
| Production run | 1990– | — | — |
| Lifecycle | — | — | — |
| Lifecycle milestones | — | — | — |
| Control system | — | — | — |
| Generation | — | — | — |
| Family | Mattson Aspen | Mattson Aspen | Mattson Aspen |
| Cited variants | |||
| Specifications | |||
| Wafer size | 100 mm, 150 mm, 200 mm (Aspen II); 200 mm, 300 mm (Aspen III)[1] | 6 inch[4] | 8 inch[11] |
| Process type | Strip, etch, CVD (PECVD)[3] | — | — |
| Process chamber configuration | Dual wafer chamber design; single or dual process chambers (Aspen II); one, two, or three process chambers (Aspen III)[2] | — | — |
| Throughput (Aspen II strip) | 90-130 wafers per hour with one chamber; 110-160 wafers per hour with two chambers[2] | — | — |
| Throughput (Aspen III strip) | ≥200 wafers per hour with three chambers[2] | — | — |
| Throughput (Aspen III CVD) | Up to 180 wafers per hour, depending on film type[3] | — | — |
| Temperature range (Aspen II ICP) | 100°C to 250°C[1] | — | — |
| Temperature range (eHighlands chamber) | Low temperature (10°C to 80°C)[1] | — | — |
| Pressure range (eHighlands chamber) | Low pressure (5 mT to 300 mT)[1] | — | — |
| Warped wafer handling | Supports warped (> 5 mm) wafers[1] | — | — |
| Installed base | More than 500 Aspen III systems installed worldwide; more than 1,000 Aspen II systems installed[1] | — | — |
| Configuration | — | Convertible to 8"[4] | Low K[11] |
| Manufacturer | — | Mattson[4] | — |
| Model | — | Aspen II[4] | — |
| Type | — | Asher[4] | — |
| Wafer Sizes Supported | — | 6 inch[4] | — |
| Vintage | — | 1994 Vintage[7] | — |
| OEM / Make | — | Mattson[4] | — |
| Tool type | — | Asher[4] | — |
| Wafer size (convertible) | — | 6 inch, convertible to 8 inch[4] | — |
| Unit manufacture vintage (unit 130502) | — | 1994[7] | — |
| Unit manufacture vintage (unit 130501) | — | 1996[8] | — |
| Convertibility | — | 6" convertible to 8"[4] | — |
| Wafer sizes (Highlands) | — | — | 200 / 300 mm[9] |
| Wafer sizes (CVD) | — | — | 200 / 300 mm bridge tool[10] |
| Process technology (Highlands) | — | — | Proprietary ICP technology[9] |
| Processing capability (Highlands) | — | — | Dual-wafer processing[9] |
| Design (Highlands) | — | — | Modular design allowing process modules to be added[9] |
| Throughput (CVD) | — | — | Up to 180 wafers per hour[10] |
| Deposited films (CVD) | — | — | Silane-based films (oxide, oxynitride, nitride) and TEOS-based oxide films[10] |
| Bridge capability (CVD) | — | — | Same process chamber can process either 200mm or 300mm wafers[10] |
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