Waferpedia

Comparison ledger

Fusion HFTversusFusion MX

LTX-Credence Fusion HFT, LTX-Credence Fusion MX, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
Fusion HFTLTX-Credence
Fusion MXLTX-Credence
OEMLTX-CredenceLTX-Credence
CategoryTest & ProbeTest & Probe
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLTX-Credence FusionLTX-Credence Fusion
Specifications
Primary BUENT[1]—
DevelopmentNPI / Production[1]—
InstrumentFusion HFI[1]—
ConfigurationSolaris[1]With:[2]
Digital Pin512[1]—
Primary Business UnitENT[1]—
Development PhaseNPI / Production[1]—
SoftwareSolaris[1]—
Digital Pins512[1]—
Cage 0 ComponentsWorkstation, VME Crate VX4, AC/DC MPDU Crate, CPS (8 Channels), DPS (4 Channels), SMS (2 Channels), Analog Pin AP (16 Channels), RF 3500 (4 Channels), RF Generator R&S (3), Test Head User Power Supplies, Time Measurement Unit[1]—
Cage 1 ComponentsTesthead Digital Card Cage (512 Channels) PECVX, Power Supplies for Digital, Cooler, CTMU MUX / Wavecrest, DPRO 4 for VX4 (0 to 127 Channel)[1]—
Vintage2004[1]—
974-0026-02—SBA[2]
974-0122-00—OVI[2]
974-0259-01—HVVI[2]
974-1004-03—DIGHSB[2]
974-1061-01—FX2[2]
974-1108-00 / 974-1110-00—TMBDFX[2]
974-1025-02—VI16B[2]
974-1157-00—SWG[2]
Submodules—974-0026-02 SBA, 974-0122-00 OVI, 974-0259-01 HVVI, 974-1004-03 DIGHSB, 974-1061-01 FX2, 974-1108-00 / 974-1110-00 TMBDFX, 974-1025-02 VI16B, 974-1157-00 SWG[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing