Comparison ledger
Logitech 1 WBS 1 Wafer Substrate, West Bond wirebond1, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1 WBS 1 Wafer SubstrateLogitech | wirebond1West Bond |
|---|---|---|
| OEM | Logitech | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Logitech 1 WBS 1 Wafer Substrate | West Bond wirebond1 |
| Specifications | ||
| Wafer Size | 6 inch[1] | — |
| vendor | — | West-Bond Inc.[2] |
| model | — | 747677E[2] |
| equipment type | — | manual wirebond tool[2] |
| bonding methods | — | wedge bonding and ball bonding[2] |
| wire type typically configured | — | 1 mil (25 μm) Au wire[2] |
| bonding configuration | — | ball bonding configuration[2] |
| system features | — | Triple convertible tool enabling 45° wedge, 90° (deep access) wedge and ball bonding[2] |
| compatible wire materials | — | Al and Au wires[2] |
| compatible wire diameter range | — | 0.7 mil to 2 mil[2] |
| bonding mode | — | room temperature thermosonic bonding[2] |
| heated workholders | — | Multiple heated workholders available[2] |
| ultrasonic transducer | — | 4 W 63 kHz[2] |
| manual control | — | 8:1 reduction ratio micromanipulator arm[2] |
| Operation | — | Manual[2] |
| Bonding methods | — | Wedge and ball bonding[2] |
| Wire types and diameters | — | Al and Au wires from 0.7 mil to 2 mil in diameter[2] |
| Micromanipulator arm | — | Manual control via 8:1 reduction ratio micromanipulator arm[2] |
| Convertibility | — | "Triple convertible" tool enabling 45° wedge, 90° (deep access) wedge and ball bonding[2] |
| Bonding temperature | — | Room temperature thermosonic bonding[2] |
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