Waferpedia

Comparison ledger

H6-23versusWS-650

Laurell H6-23, Laurell WS-650, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
H6-23Laurell
WS-650Laurell
OEMLaurellLaurell
CategorySpin coaterSpin coater
Wafer size150mm150mm
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation650-series HL—
FamilyLaurell H6-23Laurell WS-650
Specifications
Maximum rotational speed12,000 RPM (based on a ø 100mm silicon wafer)[1]—
Wafer capacityUp to ø 150mm wafers[1]—
Substrate capacity5" × 5" (127mm × 127mm) substrates[1]—
Power95 to 240VAC, 47/63HZ, ~300 Watts[1]—
CategorySpin coater[1]—
Wafer sizeUp to 150 mm wafers[1]—
Substrate size5 in x 5 in (127 mm x 127 mm) substrates[1]Up to 150 mm round substrates and 125 mm square substrates[2]
Speed basisBased on a 100 mm silicon wafer[1]—
Series650-series HL coater system[1]—
Equipment type—Cleanroom Instrumentation; Thin Film Fabrication[2]
Use—Should be used only for spincoating of photoresists[2]
Speed range—100-12,000 RPM[2]
Substrate thickness—0.1 to 1 mm[2]
Adapter—Wafer Fragment Adapter for 10–50 mm substrate fragments[2]
Location—FNT 4.106[2]
Installed location—Photolithography hood[2]
Model—Laurell WS-650[3]
Type—Spin coater[3]
Purpose—Coating photoresist on samples of various sizes[3]
Wafer size support—50 mm through 150 mm substrates[3]
Controller speed range—100-8000 rpm[3]
Speed resolution—0.5 rpm[3]
Program capacity—Up to twenty 51-step programs[3]
Vacuum chuck—1.75 inch natural propylene vacuum chuck[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]tmi.utexas.edutmi.utexas.edu
  3. [3]aggiefab.tamu.eduaggiefab.tamu.edu