Comparison ledger
Laurell EDC-HL-23, Laurell WS-650, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | EDC-HL-23Laurell | WS-650Laurell |
|---|---|---|
| OEM | Laurell | Laurell |
| Category | Spin coater | Spin coater |
| Wafer size | 150mm | 150mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | 650-series | — |
| Family | Laurell EDC-HL-23 | Laurell WS-650 |
| Cited variants |
| — |
| Specifications | ||
| Process controller | 650-series process controller[1] | — |
| Wafer capacity | Up to 150 mm wafers[1] | — |
| Substrate capacity | Up to 5 in x 5 in (127 mm x 127 mm) substrates[1] | — |
| Maximum rotation capability | 12,000 RPM with vacuum hold-down[1] | — |
| Recommended operating speed | 3,000 RPM with non-vacuum chucks[1] | — |
| Power | 95 to 240 VAC, 47/63 Hz, ~300 Watts[1] | — |
| Nitrogen/CDA seal purge pressure | 60–70 PSIG (4–5 bar)[1] | — |
| Vacuum recommendation | 25–28 inches Hg with 4.5 SCFM at 0 inches Hg[1] | — |
| Equipment type | — | Cleanroom Instrumentation; Thin Film Fabrication[2] |
| Use | — | Should be used only for spincoating of photoresists[2] |
| Speed range | — | 100-12,000 RPM[2] |
| Substrate size | — | Up to 150 mm round substrates and 125 mm square substrates[2] |
| Substrate thickness | — | 0.1 to 1 mm[2] |
| Adapter | — | Wafer Fragment Adapter for 10–50 mm substrate fragments[2] |
| Location | — | FNT 4.106[2] |
| Installed location | — | Photolithography hood[2] |
| Model | — | Laurell WS-650[3] |
| Type | — | Spin coater[3] |
| Purpose | — | Coating photoresist on samples of various sizes[3] |
| Wafer size support | — | 50 mm through 150 mm substrates[3] |
| Controller speed range | — | 100-8000 rpm[3] |
| Speed resolution | — | 0.5 rpm[3] |
| Program capacity | — | Up to twenty 51-step programs[3] |
| Vacuum chuck | — | 1.75 inch natural propylene vacuum chuck[3] |
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