Comparison ledger
Lapmaster 12 Lapper, Ontrak DSS 200 Post, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 12 LapperLapmaster | DSS 200 PostOntrak |
|---|---|---|
| OEM | Lapmaster | Ontrak |
| Category | CMP | CMP |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | — | Ontrak DSS 200 |
| Cited variants | — | |
| Specifications | ||
| Outside plate diameter | 12 inches[3] | — |
| Lapping Speed Range | 0 to 60 rpm[4] | — |
| Wafer Size Compatibility | 4 inches or smaller[3] | — |
| Input Voltage | 110 V[3] | — |
| Frequency | 60 Hz[3] | — |
| Phase | 1[3] | — |
| Number of Rings | 3[3] | — |
| Number of Weights | 3[3] | — |
| Includes Slurry System | Yes[3] | — |
| Includes Timer | Yes[3] | — |
| Configuration | — | With Hepa Mini-Environment[5] |
| Tool type | — | double-sided PVA scrubber[2] |
| Wafer size range | — | 100mm to 200mm[1] |
| Throughput | — | 45-65 wafers per hour[2] |
| Post-CMP cleaning applications | — | oxide, polysilicon, nitride, tungsten, aluminum and copper[2] |