Waferpedia

Comparison ledger

12 LapperversusPM5

Lapmaster 12 Lapper, Logitech PM5, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
12 LapperLapmaster
PM5Logitech
OEMLapmasterLogitech
CategoryCMPCMP
Wafer size—100mm
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
Family—Logitech PM5
Specifications
Outside plate diameter12 inches[1]—
Lapping Speed Range0 to 60 rpm[2]—
Wafer Size Compatibility4 inches or smaller[1]—
Input Voltage110 V[1]—
Frequency60 Hz[1]—
Phase1[1]—
Number of Rings3[1]—
Number of Weights3[1]—
Includes Slurry SystemYes[1]—
Includes TimerYes[1]—
Manufacturer—Logitech[3]
Model—PM5[3]
Application—Polishing and lapping[3]
Abrasive autofeed cylinder compatibility—Abrasive autofeed cylinder for use with a Logitech PM5 or LP50 system[4]
Sample wafer size—4 inch (100mm) or smaller[5]
Power supply voltage—Single phase AC100V[5]
Machine type—Lapping and polishing system[5]
Number of workstations—Single[6]
Wafer size—100 mm (4 inches) or smaller[5]
Polishing plate material—Stainless steel[5]
Lapping plate material—Cast iron[5]
Sample holding method—Vacuum[5]
Variable plate speed—Yes[5]
Slurry delivery method—Peristaltic pump[5]
Roller arm assembly—Yes[5]
Emergency stop—Yes[5]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]jmind.comjmind.com
  2. [2]etd.ohiolink.eduetd.ohiolink.edu
  3. [3]smif.pratt.duke.edusmif.pratt.duke.edu
  4. [4]web.archive.orgweb.archive.org
  5. [5]manualslib.commanualslib.com
  6. [6]waferpedia.comwaferpedia.com