Waferpedia

Comparison ledger

P-15versusP-2

KLA P-15, KLA P-2, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
P-15KLA
P-2KLA
OEMKLAKLA
CategoryMetrology & InspectionMetrology & Inspection
Wafer size200mm200mm
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyKLA P-15KLA P-2
Specifications
Sample table200 mm sample table with vacuum[1]200 mm sample table with vacuum[4]
Measurement rangeMeasures steps from 100 Å to 300 µm[1]Measures steps from 100 Å to 300 µm[4]
Maximum sample thickness20 mm[1]20 mm[4]
Minimum sample length25 mm[1]25 mm[4]
Tool typeProfilometer[2]—
Measurement capabilitiesMeasures roughness, waviness, step height, and other surface characteristics[3]—
Wafer capabilityUp to 8"/200mm wafer capable[3]—
Control platformWindows NT[3]—
Software versionProfiler v6.41[3]—
AutomationComputer controlled; automatic measurement capability[3]—
Model—P-2[2]
OEM—KLA Tencor[2]
Equipment type—Profilometer[2]
Feature—3D scan option[4]
Wafer size—200mm[5]
3D scan option—Yes[4]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]nanofab.ece.cmu.edunanofab.ece.cmu.edu
  2. [2]nanofab.ece.cmu.edunanofab.ece.cmu.edu
  3. [3]classoneequipment.comclassoneequipment.com
  4. [4]nanofab.ece.cmu.edunanofab.ece.cmu.edu
  5. [5]waferpedia.comwaferpedia.com