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Comparison ledger

OP 7341 XP Film Thickness Measurementversus150 e Mask

KLA OP 7341 XP Film Thickness Measurement, SUSS MicroTec 150 e Mask, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
150 e MaskSUSS MicroTec
OEMKLASUSS MicroTec
CategoryLithographyLithography
Wafer size25 wafer load ports (Asyst) with robot transfer (2 paddies)—
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyKLA OPSUSS MicroTec 150 e Mask
Specifications
ConfigurationCD (1D & 2D features) & film stack measurement[1]—
Wafer size25 wafer load ports (Asyst) with robot transfer (2 paddies)[1]—
SoftwareUNT 6.0[1]—
OEMKLA / Therma-wave[1]—
ModelOP 7341 XP[1]—
Measurement functionsCD (1D & 2D features) & film stack measurement[1]—
AlignmentPrealigner & full alignment using Vision Processing[1]—
ComputingExternal Server SuperGrendel for fast computation (168 cores)[1]—
Load ports25 wafer load ports (Asyst) with robot transfer (2 paddies)[1]—
EnvironmentIntegrated Mini-Environment[1]—
Measurement chamberSeparated optical table design[1]—
Motion isolationPneumatic floating system ensuring no vibration for both stage and optics tables[1]—
User interfacesTwo user interface (Front & Read)[1]—
CommunicationSECS / GEM full capability[1]—
Auto-focusIncluded[1]—

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Sources (1)Every fact above is drawn from these public sources
  1. [1]inventory listing