Comparison ledger
KLA 0035235-003 MMD Head, Onto Innovation NSX 330 B, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | NSX 330 BOnto Innovation | |
|---|---|---|
| OEM | KLA | Onto Innovation |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | — | Three simultaneous color defect review methods: on-the-fly, high resolution, whole wafer |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | KLA 0035235-003 MMD Head | Onto Innovation NSX 330 |
| Specifications | ||
| Configuration | TSTD PCB ASSY, MMD MEAS HEAD[1] | Programmable light tower[2] |
| Model | 0035235-003[1] | — |
| Make | KLA[1] | — |
| Part Description | TSTD PCB ASSY, MMD MEAS HEAD[1] | — |
| Compatible System | KLA AIT-XP[1] | — |
| Wafer size | — | Three simultaneous color defect review methods: on-the-fly, high resolution, whole wafer[2] |
| Category | — | Metrology & Inspection[3] |
| Inspection modes | — | Three simultaneous color defect review methods: on-the-fly, high resolution, whole wafer[3] |
| Resolution flexibility | — | 10µm to 0.5µm[2] |
| Optics | — | Programmable illumination filter wheel[3] |
| Illumination | — | Programmable light tower; multiple modes of dark field illumination[2] |
| Control/software | — | Recipe sharing; recipe server; Discover® Software database results archiving[3] |
| Options | — | Teams with edge and backside modules for all-surface solution[2] |
| Handling | — | Unique handling solutions (Mems, Taiko, Thin), extreme warpage (>12mm) and ultra-thin (<50µm)[2] |
| Objective turret | — | Five available slots; compatible with 1X, 2X, 3X, 5X, 10X, 20X, and 50X objectives[2] |
| Tool matching | — | Supported[2] |
| Vintage | — | 2017[2] |
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