Waferpedia

Comparison ledger

1826versus0332 F 9453 302 Diffusion

Heller 1826, Varian 0332 F 9453 302 Diffusion, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
1826Heller
OEMHellerVarian
CategoryThermal / DiffusionThermal / Diffusion
Wafer size——
Process node——
Introduced2012—
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyHeller 1826Varian 0332 F 9453 302 Diffusion
Cited variants
  • 1826 Air Mark 5 Reflow OvenMark 5[1]
—
Specifications
Model1826 MK7 Reflow Oven System[2]—
TypeHigh volume reflow oven system[2]—
Heated zones8 heated zones[2]—
Belt speedUp to 1.88 m/min[2]—
Oven length465 cm (183 in)[2]—
Process gas optionsAir, Nitrogen[2]—
Heating arrangementConvection: 10 Top / 10 Bottom[2]—
Heated length360 cm (142 in)[2]—
Cool zones2 Top (Bottom Option)[2]—
Max working temperatureStandard: 350°C; Option: 400°C[2]—
Maximum PCB width55.9 cm (22 in)[2]—
FeaturesBuilt-in thermal monitoring, nitrogen capable to < 100 ppm, energy management system, virtually no maintenance, 12 in wide heater modules[2]—
Thermal monitoringBuilt-in Thermal Monitoring[2]—
Nitrogen capabilityNitrogen capable to < 100 ppm[2]—
Energy managementEnergy Management System[2]—
MaintenanceVirtually no maintenance[2]—
Heater modules12 in wide heater modules[2]—
Cleanroom optionDown to Class 1000[2]—
Asset Number—142841[3]
Last Confirm Date—October 14, 2025[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]web.archive.orgweb.archive.org
  3. [3]Equipment inventory listing
  4. [4]fab-spares.comfab-spares.com