Waferpedia

Comparison ledger

1088versus1826

Heller 1088, Heller 1826, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
1088Heller
1826Heller
OEMHellerHeller
CategoryThermal / DiffusionThermal / Diffusion
Wafer size——
Process node——
Introduced—2012
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyHeller 1088Heller 1826
Cited variants—
  • 1826 Air Mark 5 Reflow OvenMark 5[1]
Specifications
Heating Zones8 zones (4 top and 4 below) plus 1 cooling zone[2]—
Heating MethodForced convection[2]—
Conveyor Width18 inches (45 cm)[2]—
Heated Length43.5 inches (111 cm)[2]—
Overall Length96 inches (244 cm)[2]—
Height50 inches (127 cm)[2]—
Net Weight900 lbs (409 kg)[2]—
Thermal ProfilerIncluded[2]—
Oven TopCounter balance for easy access to conveyor[2]—
Solder CompatibilityLead-free and leaded soldering[2]—
Model—1826 MK7 Reflow Oven System[3]
Type—High volume reflow oven system[3]
Heated zones—8 heated zones[3]
Belt speed—Up to 1.88 m/min[3]
Oven length—465 cm (183 in)[3]
Process gas options—Air, Nitrogen[3]
Heating arrangement—Convection: 10 Top / 10 Bottom[3]
Heated length—360 cm (142 in)[3]
Cool zones—2 Top (Bottom Option)[3]
Max working temperature—Standard: 350°C; Option: 400°C[3]
Maximum PCB width—55.9 cm (22 in)[3]
Features—Built-in thermal monitoring, nitrogen capable to < 100 ppm, energy management system, virtually no maintenance, 12 in wide heater modules[3]
Thermal monitoring—Built-in Thermal Monitoring[3]
Nitrogen capability—Nitrogen capable to < 100 ppm[3]
Energy management—Energy Management System[3]
Maintenance—Virtually no maintenance[3]
Heater modules—12 in wide heater modules[3]
Cleanroom option—Down to Class 1000[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]smtdevices.comsmtdevices.com
  3. [3]web.archive.orgweb.archive.org