Comparison ledger
Esec 2009 fS E, Esec Esec 2100 hS iXplus, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 2009 fS EEsec | |
|---|---|---|
| OEM | Esec | Esec |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | 4" | 4" |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | 3rd generation | — |
| Family | Esec 2009 fS E | Esec Esec 2100 hS iXplus |
| Specifications | ||
| Machine type | Die bonder[1] | — |
| Platform description | 3rd generation of the most flexible 300 mm high speed platform[1] | — |
| Bonding method | Epoxy[1] | Epoxy[1] |
| Cycle time | 120 ms with Liquid Cooling option[1] | 120 ms with Liquid Cooling option[1] |
| Bonding accuracy | 20 µm @ 3σ (15 µm option)[1] | 20 µm @ 3σ (15 µm option)[1] |
| Wafer size | 4" to 12" (on 8" or 12" wafer frames)[1] | 4" to 12" (on 8" or 12" wafer frames)[1] |
| Die size | 0.25 mm (with Small Die Kit) to 20 mm[1] | 0.25 mm (with Small Die Kit) to 20 mm[1] |
| Leadframe size | Length: 90 to 300 mm; Width: 23 to 100 mm[1] | Length: 90 to 300 mm, Width: 23 to 100 mm[1] |
| Machine dimensions | 1785 x 1448 x 1400 mm (W x D x H)[1] | 1785 x 1448 x 1400 mm (W x D x H)[1] |
| Power | — | 2.3 kVA[2] |
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