Waferpedia

Comparison ledger

KR15versus15

Disco KR15, Lapmaster 15, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
KR15Disco
15Lapmaster
OEMDiscoLapmaster
CategoryDicing & GrindingDicing & Grinding
Wafer size8"—
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco KR15Lapmaster 15
Cited variants
  • KR15-A/KR15-B[1]
—
Specifications
Blade designationDisco KR15[2]—
Blade thickness200 micron[2]—
Blade gritlow grit[2]—
Intended materialssapphire, glass, and silicon[2]—
Max. workpiece sizeΦ8"[2]—
Thickness200 micron[2]—
GritLow grit[2]—
Materialssapphire, glass, and silicon[2]—
Input Power—110 Vac[3]
Plate Diameter—15 inches (381 mm)[4]
Number of Conditioning Rings—3[4]
Ring ID—5.5 inches (140 mm)[4]
Standard RPM—60[4]
RPM Range (Variable Speed Drive)—0-60[4]
Drive Motor - Lapper—0.5 HP (0.37 kW)[4]
Drive Motor - Polisher—0.75 HP (0.56 kW)[4]
Length—25 inches (635 mm)[4]
Width—20 inches (508 mm)[4]
Height—24 inches (610 mm)[4]
Estimated Shipping Weight—285 lbs (129.3 kg)[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]thk.comthk.com
  2. [2]aggiefab.tamu.eduaggiefab.tamu.edu
  3. [3]inventory listing
  4. [4]web.archive.orgweb.archive.org