Comparison ledger
Disco DGP 8761 DFM 2800, Lapmaster 120 Continuous, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | DGP 8761 DFM 2800Disco | 120 ContinuousLapmaster |
|---|---|---|
| OEM | Disco | Lapmaster |
| Category | CMP | CMP |
| Wafer size | Wafer Notch Visual Monitoring Alignment Option | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco DGP 8761 | Lapmaster 120 Continuous |
| Cited variants |
| — |
| Specifications | ||
| Configuration | 12 inch Kits[1] | — |
| Phase | 3 phase[1] | — |
| Full Load current | 72 A[1] | — |
| Machine Main breaker Rating | 90 A[1] | — |
| Ampere Rating of Largest Load | 33 A[1] | — |
| Interrupt Capacity | 35 kA[1] | — |
| Short Circuit Current Rating | 5000 A[1] | — |
| Full load Amps | 40 A[1] | — |
| Voltage | 200V +/-10%[1] | — |
| Ampere Rating of Largest load | 25 A[1] | — |
| Mapping | Load FOUP Department (Carrier Wafer Slot and Insert Slash) with Mapping Perception[2] | — |
| Cut Function | 2 functions : Batch Cut and Pre Cut 2 functions[2] | — |
| Robot Pick Inline Dedicated | (200 mm / 300 mm wafer dedicated)[4] | — |
| Spinner Table | 200 mm / 300 mm Universal (Orientation Flat)[4] | — |
| FOUP Opener | Unit 300 mm Wafer Dedicated (with 200 mm adapter)[4] | — |
| Wafer Sizes | 8 inch, 12 inch[1] | — |
| Spindle Configuration | 3 Axis Dry Polishing (DP) Type 2 - Z1 Grinder - Z2 Grinder - Z3 Polisher[1] | — |
| DGP 8761 Power Frequency | 50/60 Hz[1] | — |
| DGP 8761 Phase | 3 phase[1] | — |
| DGP 8761 Full Load Current | 72 A[1] | — |
| DGP 8761 Main Breaker Rating | 90 A[1] | — |
| DGP 8761 Ampere Rating of Largest Load | 33 A[1] | — |
| DGP 8761 Interrupt Capacity | 35 kA[1] | — |
| DGP 8761 Short Circuit Current Rating | 5000 A[1] | — |
| DFM 2800 Power Frequency | 50/60 Hz[1] | — |
| DFM 2800 Full Load Amps | 40 A[1] | — |
| DFM 2800 Phase | 3 phase[1] | — |
| DFM 2800 Voltage | 200V +/-10%[1] | — |
| DFM 2800 Main Breaker Rating | 50 A[1] | — |
| DFM 2800 Ampere Rating of Largest Load | 25 A[1] | — |
| Accessories Available | Auto Label Printer, Dicing Tape Pre-Cut Unit[1] | — |
| Cut Functions | Batch Cut and Pre Cut; DBG, SDBG, Auto TTV function included[2] | — |
| S-DBG Specification | DISCO Positioning Table 300mm Acrylic, T-arm1 300mm Porous Type[2] | — |
| Polishing Wheel Specifications | Applicable GDP Polishing Wheel Specifications (Z3-axis)[2] | — |
| Ionizer Units | 12ea specification (DISCO Pure 9ea + LOCAL 3ea)[2] | — |
| Polishing Residence Collector | DISCO Dry Vacuum Cleaner[2] | — |
| UPS System | 2 units[2] | — |
| DTU1531 | 2 units[2] | — |
| DFM2800 BG Tape UV Chamber Option | Included[2] | — |
| Wafer Notch Visual Monitoring Alignment Option | Included[2] | — |
| Attachment Table, Peeling Table Temperature Option | Included[2] | — |
| Attachment Part, Peeling Part Duct Cleaning Unit | Included[2] | — |
| Wafer ID ORC Read Option | Included[2] | — |
| Wafer ID Barcode Print Option | Included[2] | — |
| S-DBG Specification (DISCO | Positioning Table 300mm Acrylic, T-arm1 300mm Porous Type)[2] | — |
| Wafer size | Wafer Notch Visual Monitoring Alignment Option[2] | — |