Comparison ledger
Disco DFG 8830, Lapmaster 15, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | DFG 8830Disco | 15Lapmaster |
|---|---|---|
| OEM | Disco | Lapmaster |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco DFG | Lapmaster 15 |
| Specifications | ||
| Configuration | In-Feed[1] | — |
| Phase | 3 Phase[1] | — |
| Wafer size | 6 inch, 8 inch[1] | — |
| Material | SiC (silicon carbide)[1] | — |
| Max workpiece size | ø150 mm[2] | — |
| Spindle quantity | 4[2] | — |
| Spindle power (Z1–Z3) | 6.3 kW[2] | — |
| Spindle speed (Z1–Z3) | 1,000–4,000 min⁻¹[2] | — |
| Work disc quantity | 5[2] | — |
| Dimensions (W×D×H) | 1,400 × 2,500 × 2,000 mm[2] | — |
| Weight | ≈6,000 kg[2] | — |
| Maximum workpiece size | 150 mm (6 inch)[2] | — |
| Wafer sizes supported | 6 inch and 8 inch[1] | — |
| Spindle count | 4[2] | — |
| Spindle speed range | 1,000 – 4,000 min⁻¹[2] | — |
| Number of work stations | 5[2] | — |
| Dimensions (W x D x H) | 1,400 x 2,500 x 2,000 mm[2] | — |
| Material compatibility | SiC[1] | — |
| In-feed capability | Yes[1] | — |
| Power supply | 3 Phase, 3 Wire + Ground, 60 A[1] | — |
| Input Power | — | 110 Vac[3] |
| Plate Diameter | — | 15 inches (381 mm)[4] |
| Number of Conditioning Rings | — | 3[4] |
| Ring ID | — | 5.5 inches (140 mm)[4] |
| Standard RPM | — | 60[4] |
| RPM Range (Variable Speed Drive) | — | 0-60[4] |
| Drive Motor - Lapper | — | 0.5 HP (0.37 kW)[4] |
| Drive Motor - Polisher | — | 0.75 HP (0.56 kW)[4] |
| Length | — | 25 inches (635 mm)[4] |
| Width | — | 20 inches (508 mm)[4] |
| Height | — | 24 inches (610 mm)[4] |
| Estimated Shipping Weight | — | 285 lbs (129.3 kg)[4] |
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