Comparison ledger
Disco 3220, Kulicke & Soffa 782-6, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 3220Disco | 782-6Kulicke & Soffa |
|---|---|---|
| OEM | Disco | Kulicke & Soffa |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | 6" |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco 3220 | Kulicke & Soffa 782-6 |
| Specifications | ||
| equipment type | dicing saw[1] | — |
| Workplace size | ø150 mm[2] | — |
| Spindle layout | Single[2] | — |
| Spindle output | 1.5 kW at 30,000 min-1[2] | — |
| Spindle max revolution speed | 40,000 min-1[2] | — |
| X-axis feed speed range | 0.1 – 500 mm/s[2] | — |
| Y-axis index step | 0.0001 mm[2] | — |
| Z-axis repeating accuracy | 0.001 mm[2] | — |
| Z-axis max blade size | ø58 mm[2] | — |
| Maximum wafer size | — | up to 6" wafers[3] |
| Maximum wafer thickness | — | 800 µm thick[3] |
| Materials diced | — | Si, Glass, Quartz, SiC, Sapphire, LiNbO3[3] |
| Kerf width | — | down to 50 µm (blade dependent)[3] |
| Blade cooling and rinsing | — | DI water[3] |
| Category | — | Dicing & Grinding[4] |
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