Waferpedia

Comparison ledger

300mm-Ofenversus1000P

Despatch 300mm-Ofen, YES 1000P, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
300mm-OfenDespatch
OEMDespatchYES
CategoryWet Processing / CleanWet Processing / Clean
Wafer size300mm—
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones—1998 Acquisition
Control system——
Generation——
FamilyDespatch 300mm-OfenYES 1000P
Specifications
AutomationsfunktionNimmt sowohl 200mm als auch 300mm-Scheiben auf.[1]—
Werkzeugkapazität50 Scheiben mit Standard Zwei-Kammerkonfiguration; zusätzliche Kammern können angefügt werden.[1]—
Thermische ProzesseigenschaftenInertatmosphäre; 175°C Maximaltemperatur; Temperaturgleichmäßigkeit ±1.0°C bei 95°C Eintaucht temperatur; aktive Kühlung für schnelles Abkühlen; HEPA-Filter.[1]—
Zusätzliche EigenschaftenErfüllt SEMI S2/S8 und SEMATECH Anhänge A, B und C; grafische Benutzer-Schnittstelle (GUI); erfüllt 300mm SEMI Kommunikationsstandards; FOUP ID-Leser; 2 Ebenen Überwachung; Scheiben-ID-Leser; nicht unterbrechbare Stromversorgung (UPS).[1]—
AbmessungenEtwa 262 cm Breite und 224 cm Länge.[1]—
Automation functionAccepts both 200mm and 300mm wafers.[1]—
Tool capacity50 wafers with standard two-chamber configuration; additional chambers can be added.[1]—
Process atmosphereInert atmosphere.[1]—
Maximum temperature175°C[1]—
Temperature uniformity±1.0°C at 95°C immersion temperature.[1]—
CoolingActive cooling for rapid cool-down.[1]—
FilterHEPA filter.[1]—
Additional featuresMeets SEMI S2/S8 and SEMATECH Appendices A, B, and C; graphical user interface; meets 300mm SEMI communication standards; FOUP ID reader; 2-level monitoring; wafer ID reader; uninterruptible power supply (UPS).[1]—
DimensionsAbout 262 cm wide and 224 cm long.[2]—
Model—1000P[3]
System type—Plasma cleaning system[3]
Shelf configuration—Four 16 x 16 inch shelves[3]
Total capacity—1024 square inches[3]
Control system—PLC driven with plain English real time process readout and diagnostics in the event of system abort[3]
Number of shelves—4[3]
Shelf size—16 x 16 inches[3]
Power—1000 W[4]
Configuration—Parallel plate[4]
Operation modes—Active, RIE, Downstream[3]
Sample size range—From smallest semiconductor chip to large flat panels[3]

Plan your fab

Building a Wet Processing / Clean process? Get a complete equipment list.

Open the fab equipment planner →
Sources (4)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]waferpedia.comwaferpedia.com
  3. [3]web.archive.orgweb.archive.org
  4. [4]semistarcorp.comsemistarcorp.com