Waferpedia

Comparison ledger

Ecomat 250versus12 Lapper

Buehler Ecomat 250, Lapmaster 12 Lapper, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
Ecomat 250Buehler
12 LapperLapmaster
OEMBuehlerLapmaster
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBuehler Ecomat 250—
Specifications
ConfigurationPolisher / Grinder[1]—
Outside plate diameter—12 inches[2]
Lapping Speed Range—0 to 60 rpm[3]
Wafer Size Compatibility—4 inches or smaller[2]
Input Voltage—110 V[2]
Frequency—60 Hz[2]
Phase—1[2]
Number of Rings—3[2]
Number of Weights—3[2]
Includes Slurry System—Yes[2]
Includes Timer—Yes[2]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]jmind.comjmind.com
  3. [3]etd.ohiolink.eduetd.ohiolink.edu