Waferpedia

Comparison ledger

017-0024-01 Prealignerversus8500 Wafer

Brooks 017-0024-01 Prealigner, GCA 8500 Wafer, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMBrooksGCA
CategoryLithographyLithography
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBrooks 017-0024-01 PrealignerGCA 8500 Wafer
Specifications
Configuration—5 Axis[1]
Equipment type—Commercial wafer stepper[2]
OEM—GCA[1]
Reduction ratio—5x[1]
Exposure source—i-line[2]
Resolution capability—Sub-micron features[3]
Axis configuration—5-axis[1]
Wafer diameter—150 mm[2]
Wafer geometry supported—1-flat, 2-flat, notched, no-flat[2]
Wafer materials supported—Silicon, silicon on insulator[2]
Wafer thickness range—500–700 µm[2]
Batch size—1 wafer (150 mm)[2]
Demonstrated wafer use—6-inch silicon-on-insulator wafer[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]mems-exchange.orgmems-exchange.org
  3. [3]journals.plos.orgjournals.plos.org