Comparison ledger
Branson 101-149-053 Gold Booster, Finetech Sigma, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 101-149-053 Gold BoosterBranson | SigmaFinetech |
|---|---|---|
| OEM | Branson | Finetech |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Branson 101-149-053 Gold Booster | Finetech Sigma |
| Specifications | ||
| Configuration | 1:1.5[1] | — |
| Manufacturer | Branson[2] | — |
| Model | 101-149-053[2] | — |
| Type | Gold Booster[2] | — |
| Operating frequency | 20 kHz[3] | — |
| Gain | 1:1.5[2] | — |
| Mounting thread | 1/2-20[3] | — |
| Length | 5.4 in[3] | — |
| Gain ratio | 1:1.5[2] | — |
| FPXvision | — | High resolution magnification[4] |
| Placement accuracy | — | Sub-micron (0.5 µm on 300 mm wafer)[4] |
| Substrate size | — | Up to 300 mm[4] |
| Bonding force range | — | 0.2 to 1000 N (up to 1000 N)[5] |
| Working area | — | 450 x 150 mm[6] |
| Vacuum chamber pressure (option) | — | 10^-3 hPa[5] |
| Year of introduction (European premiere at Expoelectronica) | — | 2016[5] |
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