Waferpedia

Comparison ledger

22 AD 42versusDAD641

Blanchard 22 AD 42, Disco DAD641, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
22 AD 42Blanchard
DAD641Disco
OEMBlanchardDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 22 AD 42Disco DAD641
Specifications
Phase3 Phase[1]—
Frequency60 Hz[1]—
Voltage120 Vac[1]—
ConfigurationNo coolant tank[1]—
Tool type—Dicing saw[2]
Location—Backend Lab[2]
Tool name—Disco DAD641[3]
Blade thickness options—0.250 mm and 0.090 mm[4]
Tape thickness options—130 μm (blue tape) and 160 μm (UV tape)[4]
Substrate dicing capability—5×5 mm2 pieces[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]nanofab.utah.edunanofab.utah.edu
  3. [3]nanofab.utah.edunanofab.utah.edu
  4. [4]nanofab.utah.edunanofab.utah.edu
  5. [5]arxiv.orgarxiv.org