Waferpedia

Comparison ledger

20 36 SurfaceversusDFL 7160 Automatic

Blanchard 20 36 Surface, Disco DFL 7160 Automatic, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
20 36 SurfaceBlanchard
OEMBlanchardDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 20 36 SurfaceDisco DFL 7160
Cited variants—
  • DFL 7160 Laser Dicing[1]
Specifications
ConfigurationWith new Elecro-Matic Neutrol II Magnetic Chuck Control[2]1 Cassette port[3]
Magnetic Chuck ControlElectro-Matic Neutrol II[2]—
Wafer Size—12 inch[3]
Cassette Ports—1[3]
Dicing—Yes[4]
Circular Ring Cutting of Taiko Wafers—Yes[4]
Automation—Automatic[1]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]inventory listing
  3. [3]inventory listing
  4. [4]waferpedia.comwaferpedia.com