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Comparison ledger

20 36 Surfaceversus840

Blanchard 20 36 Surface, Disco 840, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
20 36 SurfaceBlanchard
840Disco
OEMBlanchardDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 20 36 SurfaceDisco 840
Cited variants—
Specifications
ConfigurationWith new Elecro-Matic Neutrol II Magnetic Chuck Control[2]—
Magnetic Chuck ControlElectro-Matic Neutrol II[2]—
Wafer size range—4–8 inch[1]
Spindle speed—1000–7000 rpm[1]
Vertical stroke—110 mm[1]
Planarity accuracy within wafer—0.0015 mm[1]
Chuck table type—Porous vacuum chuck[1]
Grinding wheel diameter—8 inch[1]
Number of cassettes—2[1]
Number of spindles—2 (independently adjustable)[1]
Dimensions (W × D × H)—1050 × 2150 × 1710 mm[1]
Electrical supply—200 V, 3 phase, 50/60 Hz[1]
CDA supply—0.5–0.8 MPa[1]
DI water supply—0.2–0.3 MPa, 15 l/min or higher[1]
Oil mist filtration system (optional)—Pure Boyd PBH 100[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]s3-alliance.coms3-alliance.com
  2. [2]inventory listing
  3. [3]waferpedia.comwaferpedia.com