Waferpedia

Comparison ledger

18 D SurfaceversusDAD641

Blanchard 18 D Surface, Disco DAD641, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
18 D SurfaceBlanchard
DAD641Disco
OEMBlanchardDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 18 D SurfaceDisco DAD641
Specifications
Voltage416 V[1]—
Phase3 Phase[1]—
Cycles50[1]—
Control Voltage110[1]—
MakeBlanchard[1]—
Model18 D[1]—
Asset #153970[1]—
Power416 V, 3 phase[1]—
Tool type—Dicing saw[3]
Location—Backend Lab[3]
Tool name—Disco DAD641[4]
Blade thickness options—0.250 mm and 0.090 mm[5]
Tape thickness options—130 μm (blue tape) and 160 μm (UV tape)[5]
Substrate dicing capability—5×5 mm2 pieces[6]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]Equipment inventory listing
  3. [3]nanofab.utah.edunanofab.utah.edu
  4. [4]nanofab.utah.edunanofab.utah.edu
  5. [5]nanofab.utah.edunanofab.utah.edu
  6. [6]arxiv.orgarxiv.org