Comparison ledger
Besi 2100 FC hS, Branson 101-149-053 Gold Booster, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 2100 FC hSBesi | 101-149-053 Gold BoosterBranson |
|---|---|---|
| OEM | Besi | Branson |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Besi 2100 FC hS | Branson 101-149-053 Gold Booster |
| Specifications | ||
| Configuration | Flip chip capability[1] | 1:1.5[4] |
| Bonding method | Flip Chip Bonding[2] | — |
| Bonding accuracy | 8 µm @3s (High Accuracy Mode)[2] | — |
| Min. cycle time | 240 ms (incl. dip fluxing)[2] | — |
| Wafer size | 4" to 12"[2] | — |
| Frame size | 6", 8” and 12"[2] | — |
| Die size | 0.2 to 20 mm[2] | — |
| Die thickness | ≥ 0.05 mm / ≥ 2 mils[2] | — |
| Strip dimensions | Length up to 500 mm; Width up to 125 mm (flat boats up to 137 mm)[2] | — |
| Machine dimensions | 1430 x 1440 x 1400 mm (W x D x H)[2] | — |
| Weight | Approx. 1,400 kg / 3,000 lb[2] | — |
| Bond force | 0.2 N[3] | — |
| Type | Automatic Wafer Die Attach[3] | Gold Booster[5] |
| Placement speed | Up to 16000 UPH[3] | — |
| Placement speed without dipping | Up to 12000 UPH[3] | — |
| X Y placement accuracy | 8 µm[3] | — |
| Manufacturer | — | Branson[5] |
| Model | — | 101-149-053[5] |
| Operating frequency | — | 20 kHz[6] |
| Gain | — | 1:1.5[5] |
| Mounting thread | — | 1/2-20[6] |
| Length | — | 5.4 in[6] |
| Gain ratio | — | 1:1.5[5] |
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