Waferpedia

Comparison ledger

NV GSD 200 Ionversus0216 7696, E 11368072 ESC

Axcelis NV GSD 200 Ion, Varian 0216 7696, E 11368072 ESC, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMAxcelisVarian
CategoryIon ImplantationIon Implantation
Wafer size150mm—
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAxcelis NV GSD 200Varian 0216 7696, E 11368072 ESC
Specifications
Phase3 Phase[1]—
Voltage208V, 710A[1]—
GasesB/As/Ar[1]—
Total energy200 KEV[1]—
Throughput210 pieces/hour[1]—
ConfigurationFeatures:[1]Platen ADV-S Type[2]
Wafer size6 inch[1]—
Power3 Phase, 208V, 710A[1]—
Process gasesB/As/Ar[1]—
SDS gas lines2 lines (ASH3 and PH3)[1]—
HP gas lines2 lines (BF3 and ARGON)[1]—
Cassette25 slots, 4 cassettes capacity[1]—
Source headELS source head[1]—
Control hardware2 SUN Workstations, VME 177 cell controller[1]—
Post acceleration high voltage80 KEV[1]—
DriveBelt type rotary drive[1]—
Implant angleVariable, 2-axis[1]—
Dose controllerReal-time patented dose controller[1]—
Dose range5E11~1E16 Ions/cm2[1]—
ArmStd Arm 150mm[1]—
Wafer holderStd 150mm[1]—
Beam energy5 KeV[1]—
Beam current50 mA[1]—
Electron showerP-Shower electron shower[1]—
CE markingCE marked[1]—
Beam Current50 mACE marked[1]—
Type—ESC Platen ADV-S Type[2]
Category—Ion Implantation[3]

Plan your fab

Building a Ion Implantation process? Get a complete equipment list.

Open the fab equipment planner →
Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]waferpedia.comwaferpedia.com