Waferpedia

Comparison ledger

200 ACUversusICP

Axcelis 200 ACU, STS ICP, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
200 ACUAxcelis
ICPSTS
OEMAxcelisSTS
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAxcelis NV GSD 200STS ICP
Cited variants—
  • STS ASE ICP DRIE – FluorineICP[1]
  • STS Multiplex ICPICP[2]
Specifications
ConfigurationParts Machine[3]—
ManufacturerAxcelis[3]—
Model200 ACU[3]—
Tool typeAsher[3]Inductively coupled plasma etcher[7]
Wafer size200mm[5]100 mm wafers[2]
Serial numberAU6A356AH[5]—
Computer systemM 200 PC, M 200[6]—
Part numberSC 4572 A[6]—
Volts208[6]—
Amps30[6]—
Equipment typeAsher[3]—
Wafer configuration8 inch[4]—
Voltage—400 V[7]
Frequency—50 Hz[7]
Technology—Inductively Coupled Plasma (ICP)[7]
Electrical configuration—400 V, 50 Hz[7]
Process class—Dry etcher[2]
Chemistry—Chlorine and bromine chemistry[2]

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Sources (7)Every fact above is drawn from these public sources
  1. [1]cores.research.asu.educores.research.asu.edu
  2. [2]epfl.chepfl.ch
  3. [3]inventory listing
  4. [4]semistarcorp.comsemistarcorp.com
  5. [5]wotol.comwotol.com
  6. [6]semistarcorp.comsemistarcorp.com
  7. [7]inventory listing