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Comparison ledger

200 ACUversusAutoEtch 590

Axcelis 200 ACU, Lam Research AutoEtch 590, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
200 ACUAxcelis
AutoEtch 590Lam Research
OEMAxcelisLam Research
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAxcelis NV GSD 200Lam Research AutoEtch 590
Specifications
ConfigurationParts Machine[1]Cassette-to-cassette automatic plasma etching platform[5]
ManufacturerAxcelis[1]—
Model200 ACU[1]AutoEtch 590[6]
Tool typeAsher[1]—
Wafer size200mm[3]4"~6"[5]
Serial numberAU6A356AH[3]—
Computer systemM 200 PC, M 200[4]—
Part numberSC 4572 A[4]—
Volts208[4]—
Amps30[4]—
Equipment typeAsher[1]Etcher[6]
Wafer configuration8 inch[2]—
Chamber structure—Double airlock chamber structure[5]
Plasma configuration—Parallel plate plasma etching configuration[5]
Wafer handling—Automatic cassette-to-cassette wafer handling; single wafer plasma etch processing platform[5]
Control system—Upgraded Allwin21 PC controller and touchscreen monitor[5]
Programmable parameters—RF power, chamber pressure, gas flow control, electrode spacing, multi-step process recipes[5]
OEM—Lam Research[6]
Process platform—Single wafer plasma etch processing platform[5]
Control interface—Allwin21 upgraded PC controller and industrial touchscreen monitor interface[5]
Process parameters—Programmable RF power, chamber pressure, gas flow control, electrode spacing, and multi-step process recipes[5]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]semistarcorp.comsemistarcorp.com
  3. [3]wotol.comwotol.com
  4. [4]semistarcorp.comsemistarcorp.com
  5. [5]semistarcorp.comsemistarcorp.com
  6. [6]Equipment inventory listing