Comparison ledger
ASML Twinscan XT 1950 Hi, CHA SE600, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | SE600CHA | |
|---|---|---|
| OEM | ASML | CHA |
| Category | Lithography | Lithography |
| Wafer size | 300mm | 300mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | ASML Twinscan | CHA SE600 |
| Specifications | ||
| Configuration | HDD included[1] | — |
| Process | 193 mm immersion lithography for 38 nm resolution capacity[1] | — |
| Resolution | 38 nm Overlay: 4 nm SMO / 7 nm MMO[1] | — |
| Throughput | 148 wph (300 mm with 125 exposures at 30 ml)[1] | — |
| Power | 60 W / 6 khz Laser[1] | — |
| Overlay | 4 nm SMO / 7 nm MMO[1] | — |
| Illumination source | Zeiss Starlith 1950 with max NA of 1.35 or equivalent[1] | — |
| Illumination system | Aerial XP[1] | — |
| Illuminator alignment | P Type[1] | — |
| Alignment | Blue alignment - Blue align with Athena narrow marks leveling[1] | — |
| Leveling | Focus and field by field leveling reticle management[1] | — |
| Laser | Cymer XLR 560 i: 193 nm, 60 W / 6 kHz Laser with E95 bandwidth monitoring[1] | — |
| Environment | Class 1 environment with semi compliant MENV & FIMS assemblies controls[1] | — |
| Architecture | UNIX / SUN[1] | — |
| Standard capabilities | Focus Spot Monitoring; Circuit Dependent Focus Edge Clearance; CD-FEC; Dual E-Chucks (bonded SiSiC); Image Streaming; Lot Streaming & LS Match 2 (XT); Lot Overhead Reduction 1 & 2; Productivity Enhancement Package PEP XT: 1950 Hi; In-Situ Metrology (ILIAS Software & Sensor); LithoGuide ILIAS (SAMOS & PUPICON); UNICOM XT; DoesMapper ArF; QUASAR XL (15 slot); Reticle Shape Correction; 2DE Grind Calibration; Twinscan Overlay Package TOP XT: 1950 Hi[1] | — |
| Additional options | Water Cooling for Electronics Cabinet; Customized Illumination; Multiple DOEs; Integrated Reticle Library IRL-XP for H-SPEC Systems; Integrated Reticle Inspection System IRIS-XT; Reticle Streaming: Spotless G & H; GridMapper Twinscan; FSM Flex Package for Twinscan; Aux Port 300 mm FOUP / 25 Wafer; Smash XY Reticles: -40 nm Defect, Single Lot Tst Overlay[1] | — |
| Productivity Enhancement Package PEP XT | 1950 Hi[1] | — |
| Twinscan Overlay Package TOP XT | 1950 Hi Additional Options[1] | — |
| Reticle Streaming | Spotless G & H[1] | — |
| Wafer size | Aux Port 300 mm FOUP / 25 Wafer[1] | — |
| Smash XY Reticles | -40 nm Defect, Single Lot Tst Overlay Support Equipment[1] | — |
| Power Conditioner | 135 kVA Power Conditioning & Distribution Unit (Teal Model PCDU-XT 1900)[1] | — |
| Tool type | — | Electron Beam Lithography System[3] |
| Substrate range | — | 10 mm pieces up to 300 mm wafers[3] |
| Minimum feature size | — | less than 10 nm[3] |
| Equipment type | — | Electron beam evaporator[4] |
| Alternate description | — | Gold evaporator[5] |
| Manufacturer | — | CHA[4] |
| Part number | — | SE600[5] |
| Unit vintage date | — | 01.06.1980[4] |
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