Waferpedia

Comparison ledger

Reflexion LKversus15 Lapper

Applied Materials Reflexion LK, Lapmaster 15 Lapper, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
Reflexion LKApplied Materials
15 LapperLapmaster
OEMApplied MaterialsLapmaster
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials ReflexionLapmaster 15
Specifications
ConfigurationMiniship[1]Equipped with:[4]
Wafer size300 mm[3]—
Removal rate>6452 Å/min[3]—
Non-uniformity<4%[3]—
Pressure1.5 psi[3]—
Slurry flow rate300 ml/min[3]—
Platen/Carrier rotary speed97/103 rpm[3]—
Gas delivery300 ml/min[1]—
Number Of Conditioning Rings—Up to 3[4]
Ring ID—Up to 5.5″[4]
Plate Diameter – Outside—15″[4]
Plate Diameter – Inside—3 1/2″[4]
Standard RPM—60[4]
Drive Motor—1/2 HP[4]
Electrics—110V / 1Ph / 60Hz[4]
Dimensions – Approximate—26″(L-R) x 21″(F-B) x 22″(H)[4]
Equipped with: 15″ Cast Iron Plate—Included[4]
Equipped with: (3) Yoke/Roller Bearing Assemblies—Included[4]
Equipped with: (3) Conditioning Rings—Included[4]
Equipped with: (3) Hold Downs—Included[4]
Equipped with: 30 Minute Timer—Included[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]inventory listing
  3. [3]doi.orgdoi.org
  4. [4]inventory listing