Comparison ledger
Applied Materials Mirra Mesa CMP 5201, Lapmaster 12 Benchtop Lapping Polishing, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Mirra Mesa CMP 5201Applied Materials | 12 Benchtop Lapping PolishingLapmaster |
|---|---|---|
| OEM | Applied Materials | Lapmaster |
| Category | CMP | CMP |
| Wafer size | Wafer loss sensor | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials Mirra Mesa | Lapmaster 12 Benchtop Lapping Polishing |
| Specifications | ||
| Configuration | Oxide, W[1] | Ring lapper[5] |
| Cassette | 25 slots[1] | — |
| Tower Lamp | 4 colors[1] | — |
| Cross Arm | side to side on robot plate, 270±0.1*[1] | — |
| Motor | Yaskawa[1] | 1/3 hp / 0.25 kW motor with gear reducer[6] |
| Wafer size | Wafer loss sensor[1] | — |
| OEM | Applied Materials[1] | — |
| Model | Mirra Mesa CMP 5201[1] | 12[2] |
| Equipment type | Polisher[1] | — |
| Process configuration | Oxide, Dry In / Dry Out[1] | — |
| Cassette type | Open type cassette / 4 ports[1] | — |
| Cassette capacity | 25 slots[1] | — |
| Wafer loss sensor | Present[1] | — |
| HCLU platen size | 20 inch (3)[1] | — |
| Platen motor | Yaskawa (3)[1] | — |
| Platen speed | 1,2,3 ±5% (10–150 rpm)[1] | — |
| Platen temperature control | Present[1] | — |
| Dual wafer loss sensor with temp monitoring | Present (4)[1] | — |
| ISRM module type | Present (3)[1] | — |
| Upper platen coating | Teflon coating (3)[1] | — |
| Polish head size | 8 inch (4)[1] | — |
| Polish head rotation motor | NSK motor (4)[1] | — |
| Polish head speed | ±5% (10–120 rpm)[1] | — |
| Polish head vacuum | Membrane vacuum ±10%, upgraded vacuum eject system[1] | — |
| Polish head action | Programmable & auto action for heads 1–4[1] | — |
| Water fall type | Configured[1] | — |
| Rotary union | 3 port / zone type[1] | — |
| Head sweep | Standard head sweep, oriental motor[1] | — |
| Pad conditioner | 1 per platen (3), screw type, universal disk holder[1] | — |
| Slurry arm | Dual line output type delivery (3)[1] | — |
| Polisher lower | Malema flow meter type (6)[1] | — |
| Rotation motor | NSK motor (4)[1] | — |
| Head 1,2,3,4 speed | ±5%(10~120 rpm)[1] | — |
| Make | — | Lapmaster[2] |
| Category | — | CMP[3] |
| Type/Application | — | Single sided[4] |
| Plate diameter | — | 12 in[4] |
| No. of conditioning rings | — | 3[5] |
| Base | — | Rigid, lightweight, cast aluminum base[5] |
| Standard RPM | — | 60 RPM[5] |
| RPM range with variable speed drive | — | 0-60[5] |
| Drive motor - lapper | — | 0.5 HP[5] |
| Drive motor - polisher | — | 0.75 HP[5] |
| Length | — | 25 in[5] |
| Width | — | 18 in[5] |
| Height | — | 24 in[5] |
| Estimated shipping weight | — | 240 lbs[5] |
| Approximate weight | — | 135 lbs / 61 kg[6] |
| Approximate dimensions | — | 24.5 in × 17.5 in × 23.8 in (622 mm × 445 mm × 607 mm)[6] |
| Electrical system | — | Various voltages; 50/60 Hz; 1 phase and 3 phase to customer specification[6] |
| Abrasive feed system | — | Designed for water or oil based lapping slurries[6] |
| Automatic cycle timer | — | Automatic digital cycle timer[6] |
| Ring configuration | — | Ring lapper[5] |
| Ring ID | — | 4.25 inches[5] |