Waferpedia

Comparison ledger

Centura DPS Polyversus200 ACU

Applied Materials Centura DPS Poly, Axcelis 200 ACU, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
Centura DPS PolyApplied Materials
200 ACUAxcelis
OEMApplied MaterialsAxcelis
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials Centura DPS PolyAxcelis NV GSD 200
Cited variants
  • Centura DPS IIDPS II[1]
—
Specifications
Wafer Size6 inch[2]—
Tool TypePoly Etcher[2]—
Plasma Source TypeDecoupled Plasma Source (DPS)[1]—
RF Pulsing Frequency1 kHz to 5 kHz[1]—
Chamber Coating MaterialAlumina or Y2O3[1]—
Supported Process Node28 nm[1]—
Configuration—Parts Machine[3]
Manufacturer—Axcelis[3]
Model—200 ACU[3]
Tool type—Asher[3]
Wafer size—200mm[5]
Serial number—AU6A356AH[5]
Computer system—M 200 PC, M 200[6]
Part number—SC 4572 A[6]
Volts—208[6]
Amps—30[6]
Equipment type—Asher[3]
Wafer configuration—8 inch[4]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]chinsortech.comchinsortech.com
  2. [2]Equipment inventory listing
  3. [3]inventory listing
  4. [4]semistarcorp.comsemistarcorp.com
  5. [5]wotol.comwotol.com
  6. [6]semistarcorp.comsemistarcorp.com