Comparison ledger
Applied Materials 0041-39086 ESC Part, Lam Research AutoEtch 590, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-39086 ESC PartApplied Materials | AutoEtch 590Lam Research |
|---|---|---|
| OEM | Applied Materials | Lam Research |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | — | Lam Research AutoEtch 590 |
| Specifications | ||
| Configuration | — | Cassette-to-cassette automatic plasma etching platform[1] |
| Chamber structure | — | Double airlock chamber structure[1] |
| Plasma configuration | — | Parallel plate plasma etching configuration[1] |
| Wafer handling | — | Automatic cassette-to-cassette wafer handling; single wafer plasma etch processing platform[1] |
| Control system | — | Upgraded Allwin21 PC controller and touchscreen monitor[1] |
| Programmable parameters | — | RF power, chamber pressure, gas flow control, electrode spacing, multi-step process recipes[1] |
| OEM | — | Lam Research[2] |
| Model | — | AutoEtch 590[2] |
| Equipment type | — | Etcher[2] |
| Wafer size | — | 4"~6"[1] |
| Process platform | — | Single wafer plasma etch processing platform[1] |
| Control interface | — | Allwin21 upgraded PC controller and industrial touchscreen monitor interface[1] |
| Process parameters | — | Programmable RF power, chamber pressure, gas flow control, electrode spacing, and multi-step process recipes[1] |
Plan your fab
Building a Etch process? Get a complete equipment list.
Open the fab equipment planner →