Waferpedia

Comparison ledger

0041-26723 Bonded AssemblyversusConnx Plus Ball

Applied Materials 0041-26723 Bonded Assembly, Kulicke & Soffa Connx Plus Ball, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
Connx Plus BallKulicke & Soffa
OEMApplied MaterialsKulicke & Soffa
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0041-26723 Bonded AssemblyKulicke & Soffa Connx
Specifications
Configuration—Missing the microscope[1]
Manufacturer—Kulicke & Soffa (K&S)[1]
Model—Connx Plus Ball[2]
Category—Packaging & Bonding[2]
Equipment type—Ball bonder[2]
Family—Kulicke & Soffa Connx family[2]
Vintage—2013[2]
Documented condition—Missing the microscope[1]
OEM—Kulicke & Soffa (K&S)[2]

Plan your fab

Building a Packaging & Bonding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com