Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, Disco DAD3240, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | DAD3240Disco |
|---|---|---|
| OEM | Applied Materials | Disco |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | Disco DAD3240 |
| Specifications | ||
| Model | — | DAD3240[1] |
| OEM | — | Disco[1] |
| Equipment type | — | Automatic Dicing Saw[1] |
| Section | — | Bonding & Packaging[1] |
| Maximum substrate size | — | 200 mm (8 inch)[2] |
| Spindle power | — | 1.8 kW[2] |
| Spindle speed range | — | 6,000 rpm to 60,000 rpm[3] |
| Cut speed range | — | 0.000 to 600 mm/sec[4] |
| Index axis range | — | 210 mm[3] |
| Machine width | — | 650 mm[4] |
| Maximum depth left uncut | — | 0 mm to 10 mm in 0.001 mm increments[3] |
| Table stroke (X-axis) | — | defined by the circular shape of an 8-inch wafer[3] |
| Index step size range | — | 0 mm to 210 mm[3] |
| Spindle index range | — | 0 mm to 210 mm in 0.0001 mm increments[3] |
| Spindle stroke (Z-axis) | — | 210 mm[3] |
| Air supply pressure required | — | 0.4 MPa (minimum 0.35 MPa)[3] |
| Chuck vacuum level required | — | -60 kPa or more[3] |
| Display | — | 15-inch LCD touch panel[2] |
| Compatible wafer sizes | — | 1 inch to 8 inches[4] |
| Wafer size capability | — | 200 mm (8 inch)[6] |
| Automatic alignment | — | Yes[4] |
| Substrate shapes | — | Circular and rectangular[4] |
| Operating system | — | Common to DAD3000 series[4] |
| Type | — | Automatic dicing saw[6] |
| Description | — | Compact, manual, precision dicing saw with an automatic function[4] |
| Series | — | DAD3000 series[4] |
| LCD interface | — | 15 inch LCD touch panel and GUI[4] |
| Cut speed | — | 0.000 to 600 mm/sec[4] |
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