Waferpedia

Comparison ledger

0041-26723 Bonded Assemblyversus2000 iW+ Ultrasonic Welder

Applied Materials 0041-26723 Bonded Assembly, Branson 2000 iW+ Ultrasonic Welder, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMApplied MaterialsBranson
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0041-26723 Bonded AssemblyBranson 2000
Specifications
20—2.2[1]
EPD—101-162-115[1]
Configuration—Branson CJ 20 Transducer Converter:[1]
EDP—101-135-059[1]
Diameter—1 inch[1]
Max Booster—Gold[1]

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Sources (1)Every fact above is drawn from these public sources
  1. [1]inventory listing