Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, Besi 2009 SSI E, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | 2009 SSI EBesi |
|---|---|---|
| OEM | Applied Materials | Besi |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | Single Wafer Loader |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | Besi 2009 SSI E |
| Cited variants | — |
|
| Specifications | ||
| Configuration | — | SoftSolder Wire Dispense (OMP1,OMP780 and OMP1230)[1] |
| Wafer size | — | Single Wafer Loader[1] |
| SoftSolder Wire Dispense | — | OMP1, OMP780, OMP1230[1] |
| Wafer Handling | — | Single Wafer Loader[1] |
| Handling | — | Magazine to Magazine[1] |
| Vintage | — | 2014[1] |
| Type | — | Die Bonder[1] |
| Process capabilities | — | SoftSolder Wire Dispense (OMP1, OMP780, OMP1230)[1] |
| Material handling | — | Magazine to Magazine[3] |
| Make | — | Besi / Datacon[1] |
| Model | — | 2009 SSI E[1] |
| SoftSolder Wire Dispense Options | — | OMP1, OMP780, OMP1230[1] |
| Wafer Loader | — | Single Wafer Loader[1] |
| Equipment type | — | Die bonder[1] |
| Wire dispense | — | SoftSolder wire dispense[1] |
| Compatible OMPs | — | OMP1, OMP780, and OMP1230[1] |
| Loader type | — | Single Wafer Loader[1] |
| Handling mode | — | Magazine to Magazine[1] |
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