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Comparison ledger

0041-26723 Bonded AssemblyversusADL 838 LG 2

Applied Materials 0041-26723 Bonded Assembly, ASM ADL 838 LG 2, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMApplied MaterialsASM
CategoryPackaging & BondingPackaging & Bonding
Wafer size—Wafer System:
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0041-26723 Bonded AssemblyASM ADL 838
Specifications
Wafer size—Wafer System:[1]
Configuration—0 hours ran[1]
Input type—clamp ring / wafer expander[1]
PR system—full color, 256 grey levels[1]
Voltage—100 - 240 VAC (single phase)[1]
Frequency—50/60 Hz[1]
Full-load consumption—~ 1,500 W[1]
UPH—14,000+ (ASMPT in-house test)[1]
Die Size—6 x 6 mil - 80 x 80 mil[1]
Flip Chip Handling—standard[1]
Length—2.36" - 11.81"[1]
OEM—ASM[1]
Model—ADL 838 LG 2[1]
Category—Packaging & Bonding[2]
Tool type—Die bonder[1]
Wafer system—ASM ADL 838 family[2]
Pattern recognition system—full color, 256 grey levels[1]
Die size—6 x 6 mil - 80 x 80 mil (0.15 x 0.15mm - 2.03 x 2.03mm)[1]
Die size without up-look inspection—6 x 6 mil - 400 x 400 mil (0.15 x 0.15 mm - 10.16 x 10.16 mm)[1]
Substrate length—2.36" - 11.81"[1]
Substrate width—2.36" - 3.94"[1]
Substrate thickness—5 - 118 mil[1]
Magazine length—2.36" - 12.20"[1]
Magazine width—2.36" - 4.33"[1]
Magazine height—2.68" - 7.48"[1]
Bond force—Programmable (30 - 300g)[1]
Bond head—High force bond head[1]
Condition—0 hours ran[1]
Width—2.36" - 3.94"[1]
Thickness—5 - 118 mil[1]
Height—2.68" - 7.48"[1]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com