Waferpedia

Comparison ledger

0020 18698 Partversus150

Applied Materials 0020 18698 Part, EV Group 150, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0020 18698 PartApplied Materials
150EV Group
OEMApplied MaterialsEV Group
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0020 18698 PartEV Group 150
Cited variants—
  • EVG150 up to 300 mm[1]
Specifications
ConfigurationDial Cover, Side Local Match, Hdpcvd, Ul[2]Spin-on + spray-on module[3]
Temperature—1x hot plate 350°C[3]
Wafer sizes—6 inch, 8 inch[3]
Wafer diameter—Up to 200 mm[1]
Process modules—Up to 4 wet process modules[1]
Bake/chill units—Up to 20[1]
Bake temperature—Up to 250 °C (optional up to 350 °C)[1]
Footprint—< 3 m²[1]
Placement accuracy—< 50 μm[1]
Resist viscosity support—Up to 52000 cP[1]
Stations—2 stations (spin-on + spray-on)[3]
Hot plates—5 hot plates (1 up to 350 °C)[3]
Chill plate—1 chill plate[3]
Pumps—2 Cybor pumps, 1 syringe pump, 1 high viscosity pump[3]
OmniSpray technology—Yes (ultrasonic atomization for conformal coating)[1]
EBR/BSR—Yes (edge bead removal, back-side rinse)[3]

Plan your fab

Building a Deposition process? Get a complete equipment list.

Open the fab equipment planner →
Sources (3)Every fact above is drawn from these public sources
  1. [1]evgroup.comevgroup.com
  2. [2]inventory listing
  3. [3]inventory listing