Comparison ledger
Applied Materials 0010-22161 High EFF RF Match, SUSS MicroTec Alignment, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-22161 High EFF RF MatchApplied Materials | AlignmentSUSS MicroTec |
|---|---|---|
| OEM | Applied Materials | SUSS MicroTec |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-22161 High EFF RF Match | SUSS MicroTec Alignment |
| Cited variants | — | |
| Specifications | ||
| Make | Applied Materials[2] | — |
| Model | 0010-22161[2] | Alignment[5] |
| Description | HTESC PH 1 REV A[3] | — |
| Condition | Used[3] | — |
| Stock Number | BM6628[3] | — |
| Manufacturer | — | SUSS MicroTec[4] |
| Asset name | — | SUSS Alignment Tool[5] |
| Product family | — | Mask Alignment[1] |
| Substrate size | — | Up to 300 mm[1] |
| Alignment mode | — | Mask-to-wafer and wafer-to-wafer alignment[1] |
| Integrated metrology | — | Wafer prealignment and notch detection[1] |
| Topside alignment | — | Supported[6] |
| Backside alignment | — | Supported[6] |
| Substrate diameter range | — | 1" to 150 mm diameter[6] |
| Mask size range | — | 2.5" x 2.5" to 7" x 7"[6] |
| Maximum substrate thickness | — | 10 mm[6] |
| Resist compatibility | — | For use with i-line resists[6] |
| Tool type | — | Mask alignment[1] |
| Supported substrate size | — | up to 300 mm[1] |
| Alignment modes | — | mask-to-wafer and wafer-to-wafer alignment[1] |
| Alignment optics | — | precision optics[1] |
| Related system | — | MA/BA6 Mask Alignment System[6] |