Comparison ledger
Applied Materials 0010-18024 Pyrometer Assembly, Oxford Instruments Ionfab 300 Plus, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-18024 Pyrometer AssemblyApplied Materials | Ionfab 300 PlusOxford Instruments |
|---|---|---|
| OEM | Applied Materials | Oxford Instruments |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | 1994 Owner-stated production year |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-18024 Pyrometer Assembly | Oxford Instruments Ionfab 300 |
| Specifications | ||
| Configuration | Capable of working on Applied Materials Radiance[1] | Ion Source[2] |
| Diameter | — | 35 cm[2] |
| Few Constraints | — | Cranky Valve, Defect Pressure Gauge[2] |
| Equipment type | — | Ion beam etching and deposition system[3] |
| Beam current | — | 1-150 mA[4] |
| Beam voltage | — | 200-1500 V[4] |
| Gas | — | Ar[4] |
| Base pressure | — | ~2 x 10^-7 mbar[4] |
| Process pressure | — | > 8 x 10^-5 mbar[4] |
| Wafer size | — | 100mm, or pieces attached to a 100mm transfer wafer[4] |
| Beam diameter | — | 150 mm or reduced beam diameter using a selection of apertures[4] |
| Ion source | — | Ion source with 2 Ar lines available[2] |
| Ion source diameter | — | 35 cm[2] |
| Endpoint detection | — | End point detector based on mass spectrometer[2] |
| Transfer system | — | Load-lock for single substrates[2] |
| Substrate holder | — | Fixed to holder in process chamber by clamping ring[2] |
| Backside cooling | — | He backside cooling available[2] |
| Holder cooling | — | Water cooled[2] |
| Load-lock | — | Automatic load-lock[4] |
| Specimen holder motion | — | Continuous rotation and tilt for directional etching at oblique angles[4] |
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