Waferpedia

Comparison ledger

0010-16392 ESC Assemblyversus901ACS

Applied Materials 0010-16392 ESC Assembly, Tegal 901ACS, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010-16392 ESC AssemblyApplied Materials
901ACSTegal
OEMApplied MaterialsTegal
CategoryEtchEtch
Wafer size—75 mm, 100 mm, 125 mm, and 150 mm diameter wafers; 4-inch square wafers
Process node—1 micron
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-16392 ESC AssemblyTegal 901ACS
Cited variants—
  • Tegal 903ACS[1]
  • Tegal 981ACS[1]
Specifications
OEMApplied Materials[2]—
Model0010-16392[2]—
TypeESC Assembly[2]—
Wafer Size300 mm[3]—
Electrode ConfigurationDual[3]—
System type—Wide-gap diode reactor system[1]
Process type—Low-temperature plasma etch operations[1]
Wafer diameters—75 mm, 100 mm, 125 mm, and 150 mm diameter wafers[1]
Square wafer size—4-inch square wafers[1]
Minimum feature size—1 micron[1]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]plasmatherm.complasmatherm.com
  2. [2]Equipment inventory listing
  3. [3]spwindustrial.comspwindustrial.com